ACM Research, Inc.

Description

ACM Research, Inc. was formed in January 1998 by a team of industry veterans specifically to focus on advanced copper metallization process technology, from which the company name is derived. ACM's Ultra ECP® process technology provides the semiconductor industry with the ability to electroplate copper on thin (less than 50 Å) seed layers with excellent uniformity. In addition to copper metallization, ACM introduced the semiconductor industry to its first stress-free copper polishing system, the Ultra SFP® with atomic layer level control. ACM provides new solutions that solve some important technology challenges using copper plating and polishing specifically for copper integrated with low and ultra-low-k dielectrics.

Fact sheet

Companies nearby