Anatech USA

Description

Planar Etch Scanning Electron Microscopy Sample Preparation Substrate Preclean Plasma Surface Modification for Wetability (hydrophilic) Plasma Surface Activation for Non-Wetability (hydrophobic) Photoresist Strip Wet Etch Residue Clean Ashing Etching Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules, Flip Chips Molecular Level Cleaning Prior to Bonding, Potting, Printing, Marking Painting Planar Magnetron Sputtering Metal Thin Film Deposition Dielectric Thin Film Deposition Photomask Descum Thin Film Research Transmission Electron Microcopy Sample Preparation Inductively Coupled Plasma Etch Downstream Plasma Etch Epoxy Bleedout Removal

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