Cookson, Plc

Description

Cookson Electronics Semiconductor Products (CESP) is the business unit within Cookson Electronics that is completely focused on the needs of the semiconductor packaging industry. Cookson Electronics Semiconductor Products (CESP) is a leading supplier of innovative, high performance materials, tailored to the needs of the leading semiconductor packaging manufacturers and delivered with knowledgeable applications expertise. Our products enable our valued customers to meet the evolving and demanding needs of the industry. CESP supplies products in three product areas: - Soldering Products: Sold under the known and trusted brand of ALPHA , CESP supplies: - BGA Flux; - Flip Chip Flux; - Solder Paste for several semiconductor packaging applications: - Passive Attach - Wafer Bumping - Die Attach; and - Solder Spheres - as well as flux and solder paste for a range of other engineered applications - Epoxy Molding Compound: Sold under the leading brand PLASKON , CESP supplies leading product technology for several important applications: - Power Devices: PLASKON mold compounds can specifically meet the demanding electrical and mechanical requirements of high voltage and amperage power devices. - Memory Cards: CESP offers EMC for microSD, MSDuo and other fully molded packages that utilize thin mold caps and 1-up MAP molding. - Area Array Devices: Including PBGA, QFN, SiP and Package-on-Package devices...

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