D N S Electronics

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Working at DNSE Working at DNS Electronics is about customer service. It’s about reliability. It’s about technology leadership. And it’s about being part of a worldwide team dedicated to helping our customers succeed, and having some fun in the process. We take pride in the quality and reliability of our products and services. Dainippon Screen, DNSE's parent company, is the 6th largest manufacturer of semiconductor manufacturing equipment in the works and holds dominant market share in most of the segments in which we compete.

DNSE and our parent company Dainippon Screen Manufacturing Company have a comprehensive worldwide Business Continuation Management program in place. In the event of an emergency this site will be used to communicate business continuation information to DNSE employees. Business Continuation status will be communicated to our customers and partners on an individual basis through normal company contacts.

DNS Electronics, LLC DNS Electronics (DNSE) was established in 1987 in Sunnyvale California. DNSE is a sales, marketing, engineering and service organization responsible for operations in the US market for Dainippon Screen Manufacturing Company, Kyoto, Japan. DNSE now has 8 major local offices in the US to better serve our customers. Dainippon Screen (SCREEN) is a manufacturer of semiconductor equipment for the lithography coat/develop and wet cleaning/etching processes.

High Throughput The FC-3100 is capable of achieving a high throughput of 650 wafers per hour, which has been realized by incorporating a high throughput buffer module and a new transfer module. Stable and Highly Reliable 7 independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.

Features Dainippon Screen has succeeded in developing "Long Pulsed technology" for its Flash Lamp Anneal tool, the LA-3000-F. The "Long Pulsed Technology" complements its current (shorter pulse) offering and provides Ultra Shallow Junction (USJ) processing options for next generation device manufacturers. Device fabrication at the 65nm node and beyond places significant demands on anneal processes. High dopant activation must be achieved with extremely low time constants to control and minimize dopant diffusion. To address USJ requirements, Dainippon Screen introduced the LA-3000-F in the 2003.

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