Fine Pitch Assembly

Description

While some manufacturers talked about "Turnkey" Fine Pitch decided to offer its customers true turnkey. Only 20% of our competition provides any turnkey at all. Over the years we have developed the expertise and kept up with the latest equipment and processes to service our customers with anything from a simple hand population of a board to ultra fine pitch BGA assembly. We also design and layout boards to meet our customers demanding needs and to assist them in staying ahead of the curve in PCB manufacturing.

The peak temperature ranges at about melting point of the alloy plus 30-40 K, hence approx. 245-260°C. Peak temperature of about 235°C abound in the literature and they may be quite feasible under excellent nitrogen inertion. However, due to solderability problems encountered on components and boards and the general lack of good wetting properties for the lead-free alloys, we anticipate a slow adjustment of the peak temperatures in the area mentioned above.

Many of our customers are manufacturers that require a contract manufacturer for not only their Printed Circuit Board Assembly needs, but for the final assembly of their innovative products.

Why our customers stay with Finepitch Finepitch maintains many customers who have been with us since we started in 1984. They have experienced our extraordinary quality, satisfying value, and quick turnaround time. Finepitch never gives our customers and surprises. We avoid the glitches, broken promises, and cost overruns these customers experienced before they came to us. Finepitch has delivered and will continue to deliver on the promise of excellence. And thats what builds customer loyalty. Customers who appreciate and value Finepitch for their quality and support.

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