Integrated Packaging Assembly Corporation

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Description

Flip Chip packages provide the ideal solution for low to high I/O, high electrical performance demand in high end memory. ASIC's microprocessor applications where high frequency and high speed are required. The packageoffers pin counts in excess of 2397 with higher electrical performance compared to the traditional BGA package. i2a Technologies offers the flip chip packages both in BGA and CSP type, and continues to develope the range of flip chip interconnected packages to meet customers' demand. i2a provides a turn-key solution for wafer UBM, Solder Bumping and Flip Chip assembly.

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