Interconnect Systems, Inc.

Description

Next Level Integration brings together multiple interconnect design and assembly disciplines generally not utilized together in traditional designs. Next Level Integration is an effective tool to improve performance, lower costs and accommodate unique packaging applications. ISI has broad design and process development knowledge coupled with extensive manufacturing assets that enable us to quickly execute on Next Level Integration projects that would typically require multiple suppliers and much more time. Facilities Locations ISO Certificate United States Department of State, ITAR Registered Customer Qualifications ISI Brochure History 1988 Company founded to design, manufacture and market high pin count PPGAs. 1992 Designed and manufactured 557 I/O PPGA for GaAs die used in supercomputer, telecom equipment, and semiconductor test applications. 1993 Awarded patent for surface mounting pins to a substrate. 1997 Selected by IBM/Motorola/Apple to build PowerPC modules for Apple G3 computers. Ramped production from 250 parts per day to 10,000 per day in a four month period. Manufactured over 4 million Power PC modules through program life. 1999 Ranked No.58 on Incorporated 500 Magazine’s list of America's fastest-growing privately held companies. 2000 Designed and tooled initial socket contact for HiLo™ Flexible Interconnect System. 2000 Acquired BetaFlex of Camarillo, CA, specializing in bare die assembly and flex circuit assembly. 2000 Received ISO 9001:2000 Certification for manufacturing facilities in Camarillo, CA. ISO Certificate 2001 Acquired Emulation Technology (ET) of Santa Clara, CA, a leader in the adapter and test accessory market. Emulation Technology has one of the broadest product offerings providing well over 4,000 interconnect products to design and development engineers. 2002 Refocused our strategy to meet the emerging market for Integrated Packaging Solutions. 2005 Acquired Comm Con of Duarte, CA, a custom connector manufacturer with a complete tool shop, mold making, injection blow molding and assembly equipment capabilities. 2005 Purchased an additional 22,000 square foot building in Camarillo business park, increasing overall square footage to over 90,000. 2008 Acquired Nallatech, Incorporated of Cumbernauld, Scotland, an established leader in FPGA innovation, delivering optimized processing capability required for challenging Defense applications, such as SIGINT, SDR and Unmanned Systems. 2008 ISI receives ITAR registration from the United States Department of State ITAR Registration 2009 ISI acquires Hestia Technologies of Santa Clara, CA, bringing more than 25 years experience in semiconductor packaging and 19 issued patents to the ISI portfolio. The acquisition added several new technologies, along with a focus on high density, 3D memory packaging. 2009 Received ISO 9001:2008 Certification upgrade for two manufacturing facilities in Camarillo, CA. ISO Certificate Facilities Tour 2007-2010 Interconnect Systems, Incorporated All Rights Reserved.

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