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Description
MPE, Inc. (Micro Precision Engineering) is a corporation that was founded in 1993 to provide quick and efficient custom wafer dicing and wafer resizing services. Along with wafer dicing and resizing, we also sell a variety of both new and used dicing saws. Over the years, we have worked with hundreds of satisfied customers all over the world. Our customers have been involved in an array of different industries, including MEMS, Military, Medical, Semiconductor and MicroOptics.
The NanoAce uses a top of the range high powered air bearing spindle custom designed and manufactured by Loadpoint Bearings Ltd. Motion Control is provided in 4 axes – X, Y, Z and theta – enabling a wide range of machining operations to be performed on work pieces up to 305mm square. It has full conformity to CE safety standards.
The NanoAce is dedicated to cutting, dicing and scribing operations on materials including Alumina, BGA moldings, Ceramic, Glass, GaAs, Sapphire, Germanium, Ferrite, PZT, and Silicon.
The NanoAce uses a high-powered air bearing spindle designed and manufactured by Loadpoint Bearings and has 4 motion axes - X, Y, Z and Theta.
Work holding with rotary table and vacuum chuck designed and manufactured by Loadpoint Ltd. and Loadpoint Bearings, handles 12 in (305 mm) wafers on standard film frame carriers.