Description
With global to move toward lead-free environment, SHENMAO Micro Material Institute(SMMI) already started to research and develop Lead-Free Data since 2001 , even more, development cooperated with Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers, as well as ability to assist our customer to bring their Pb-Free products to market quickly. SHENMAO Lead-Free solder alloy have received sub-license from IOWA State University Research Foundation and Fuji Electric Holdings Company, Limited O PF606, U.S Patent No. 5.527.628 (IOWA State University Research Foundation) O PF610, Japan Patent No. 3296289. U.S Patent NO. 6179935B1 (Fuji Electric Holdings Company, Limited). SHENMAO 's lead free solder alloy available for paste, core solder wire, bar, ball/ semi ball, Bga Sphere, anode, etc.
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